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Wetware circuits 2: QRAM chips → wetware processor assembly → Wetware Processor Computer (UV circuit, Assembly Line + 64 CWU/t research)

Chain id: uv_wetware2 · Tags: Infinite source, Unverified

Era setup: UV · Abydos

Plan modules: Wetware circuits (UV and UHV circuit)

Tips: 7, 1 unverified

Machines

ZPM Chemical Reactor · 60 s · 61 440 EU/t · Sterile CleanroomZPM
RAM Wafer1Oak 12 SiC over bismuth tritelluride dust · 500 mB radonSiC over BiTe dustRadon1
up to 131 072 EU/t60 s
QRAM Wafer1
gtceu:zpm_chemical_reactor
LuV Cutter · 45 s · 30 720 EU/t · Sterile CleanroomLuV
QRAM Wafer1
up to 32 768 EU/t45 s
QRAM ChipQRAM chip x1212
gtceu:luv_cutter
ZPM Circuit Assembler · 10 s · 38 400 EU/t · CleanroomZPM
Oak 1Wetware printed board · 2 wetware processor · 3 living inductor · 6 living capacitor · 6 QRAM chip · 16 fine YBCO wirePrinted boardWetware processorLiving inductorLiving capacitor1
up to 131 072 EU/t10 s
Wetware Processor AssemblyWetware processor assembly x2 (ZPM circuit)2
gtceu:zpm_circuit_assembler
Research Station · 64 CWU/t · 38 400 EU/t · assembly in the Object HolderGregTech
Wetware Processor AssemblyWetware processor assembly x2 (ZPM circuit)1 scan
Assembly LineAssembly Line · 30 s · 64 000 EU/t (needs the orb)data orb
gtceu:research_station
Assembly Line · 30 s · 64 000 EU/t (needs the orb)Multiblock
Research StationResearch Station · 64 CWU/t · 38 400 EU/t · assembly in the Object Holderdata orbOak 1Printed board · 2 assembly · 4 living diode · 12 QRAM · 24 NOR · 48 NAND · 32 fine YBCO wire · 2 europium plate · 864 mB ITLC solder · 576 mB PBINOR chipNAND chipLiving diodeEuropium platePBI1
30 s
Wetware Processor ComputerWetware Processor Computer (UV circuit)1
gtceu:assembly_line

Flow

Direct steps

  • QRAM chip x12 → Wetware printed board · 2 wetware processor · 3 living inductor · 6 living capacitor · 6 QRAM chip · 16 fine YBCO wire (6)
  • Wetware processor assembly x2 (ZPM circuit) → Printed board · 2 assembly · 4 living diode · 12 QRAM · 24 NOR · 48 NAND · 32 fine YBCO wire · 2 europium plate · 864 mB ITLC solder · 576 mB PBI (2)

How to build

  1. Drawers first, one per input: RAM wafers, SiC over bismuth tritelluride dust, QRAM chips (Keep Exact 12), NOR chips (24), NAND chips (48), printed boards, processors, living SMDs, YBCO wire, europium plates. Drums: radon, ITLC soldering alloy, PBI. — functionalstorage:oak_1, gtceu:ram_wafer, kubejs:qram_chip, gtceu:nand_memory_chip
  2. Sterile corner: ZPM chemical reactor (wafer + 2 dust + 500 mB radon → QRAM wafer, 60 s), then a LuV cutter next to it (wafer → 12 chips, 45 s). A router or a Robot Arm cover moves the wafer; both machines inside the Sterile Cleanroom. — gtceu:zpm_chemical_reactor, kubejs:qram_wafer, gtceu:luv_cutter
  3. Assembly assembler (ZPM circuit assembler, normal cleanroom): board + 2 processors + 3 living inductors + 6 living capacitors + 6 QRAM + 16 fine YBCO → 2 assemblies per 10 s. — gtceu:zpm_circuit_assembler, gtceu:wetware_processor_assembly
  4. Research: a data orb + 1 assembly in the Object Holder, 64 CWU/t at 38 400 EU/t, then the orb into the Assembly Line Data Access Hatch (zpm_data). — gtceu:research_station, gtceu:data_orb, gtceu:wetware_processor_assembly
  5. Computer: Assembly Line buses in recipe order, 864 mB solder + 576 mB PBI by hatches; 30 s at 64 000 EU/t. Output drawer Keep Exact 4. — gtceu:assembly_line, gtceu:wetware_processor_computer
  6. Easy to miss: the computer is BOTH the UV circuit that the era multis ask for and the input of the UHV mainframe (2 per mainframe). Route the first ones to the multis, do not lock them in the mainframe line yet. — gtceu:wetware_processor_computer, functionalstorage:oak_1

Tips

  • QRAM (kjs circuits.js): chemical reactor, Sterile Cleanroom, 1200 ticks at VHA[ZPM] (61 440 EU/t): 1 RAM wafer + 2 silicon carbide over bismuth tritelluride dust + 500 mB radon → 1 QRAM wafer; cutter, Sterile Cleanroom, 900 ticks at VA[LuV]: 1 wafer → 12 QRAM chips. The wafer needs a ZPM reactor (61 440 EU/t > LuV 32 768). Both machines sit in the STERILE cleanroom of bio line 1/2. Unverified: where silicon carbide over bismuth tritelluride dust comes from.
  • Wetware processor assembly (ZPM circuit; pack recipe, circuits.js): circuit assembler, Cleanroom, 200 ticks at 38 400 EU/t: 1 wetware printed circuit board + 2 wetware processors + 3 living inductors + 6 living capacitors + 6 QRAM chips + 16 fine YBCO wire → 2 assemblies. The GT recipe (wetware_processor_assembly_zpm) still exists too: 400 ticks, printed board + 2 processors + 6 advanced SMD inductors + 12 advanced SMD capacitors + 24 RAM chips + 16 fine YBCO wire with double solder → 2 assemblies; it needs no living SMDs and no QRAM.
  • Wetware Processor Computer (UV circuit; pack recipe, assemblyLineCircuitRS): printed board + 2 assemblies + 4 living diodes + 12 QRAM + 24 NOR chips + 48 NAND chips + 32 fine YBCO wire + 2 europium plates, fluids 864 mB indium tin lead cadmium soldering alloy + 576 mB PBI, 600 ticks at 64 000 EU/t, STATION research of the processor assembly at 64 CWU/t, 38 400 EU/t. The GT recipe (wetware_super_computer_uv) and its research are removed in the pack, so no scanner route. 64 000 EU/t is a ZPM-tier recipe (Assembly Line on a ZPM or 4A hatch).
  • CWU: 64 CWU/t is 4 HPCA advanced computation components at 16 each, and each of those makes 4 cooling units of heat; an HPCA has 9 component slots and an active cooler gives 2 cooling, so one HPCA tops out around 48 CWU/t (3 advanced + 6 active coolers). 64 CWU/t therefore needs two or three HPCAs with bridge components joined by a Network Switch (uv_research; the quest text confirms the switch routes several HPCAs into the Research Station).
  • Costs for ONE computer (an assembly craft gives 2 assemblies = exactly what the computer eats): 1 assembly craft (1 printed board, 2 processors = 1 processor craft = 1 neuro unit + 1 crystal CPU + 1 nano CPU chip, 3 living inductors, 6 living capacitors, 6 QRAM, 16 fine YBCO) + 1 computer craft (1 printed board, 4 living diodes, 12 QRAM, 24 NOR, 48 NAND, 32 fine YBCO, 2 europium plates). Totals per computer: 1 neuro unit (16 stem cells), 2 printed boards, 18 QRAM chips (1.5 wafers), 24 NOR + 48 NAND chips. So 4 UV circuits via this route are 4 neuro units, 8 printed boards (one board run of 16), 72 QRAM chips (6 wafers), 96 NOR and 192 NAND chips; compare the crystal mainframe route of zpm_uv_circuit.
  • Sub-steps people skip: (1) the research writes onto a data carrier (a data MODULE at 64 CWU/t, see uv_data; Unverified for the fork) that goes into the Assembly Line’s Data Access Hatch; (2) QRAM is made in the sterile cleanroom, the assemblers in the normal one; (3) keep Keep Exact 12 on the QRAM drawer and 48 on NAND; (4) 64 000 EU/t for 600 ticks is 38 MEU per computer, size the substation first.
  • Unverified NOR/NAND chip routes at this volume; silicon carbide over bismuth tritelluride dust source.

Bill of materials

Item Qty
gtceu:assembly_line 1
gtceu:research_station 1
gtceu:zpm_circuit_assembler 1
gtceu:zpm_chemical_reactor 1
gtceu:luv_cutter 1
gtceu:zpm_energy_input_hatch_4a 1
functionalstorage:oak_1 22
modularrouters:modular_router 12
gtceu:lv_robot_arm 12
gtceu:item_filter 16
pipez:item_pipe 16
pipez:fluid_pipe 5
gtceu:steel_drum 5

Needs / Feeds

  • Main source for: gtceu:wetware_processor_assembly, gtceu:wetware_processor_computer, kubejs:qram_chip, kubejs:qram_wafer