Skip to content

Quantum chips: nano CPU wafer + radon → qubit CPU wafer → 4 chips, and the extreme circuit board (reinforced epoxy → fiber board → extreme board)

Chain id: zpm_quantum · Tags: Infinite source, Unverified

Era setup: ZPM & Classic Stargate

Plan modules: ZPM circuit (Quantum Mainframe)

Tips: 7, 1 unverified

Machines

EV Chemical Reactor in the cleanroom · 60 s · 1920 EU/tEV
Oak 150 mB radon + 1 indium gallium phosphide dust per waferRadonIndium gallium phosphide dust50 mBNano CPU Wafer1
up to 2 048 EU/t60 s
Qbit CPU WaferQubit CPU Wafer1
gtceu:ev_chemical_reactor
EV Cutter in the cleanroom · 45 s · 1920 EU/tEV
Qbit CPU WaferQubit CPU Wafer1
up to 2 048 EU/t45 s
Qbit CPU ChipQubit CPU chip · 4 per wafer4
gtceu:ev_cutter
LV Chemical Bath · 12 s · 16 EU/tLV
Oak 1Carbon fibers (or 1 fine borosilicate glass wire) + 144 mB epoxyCarbon fibersEpoxy1
up to 32 EU/t12 s
Reinforced Epoxy Resin Plate1
gtceu:lv_chemical_bath
LV Chemical Reactor · 25 s · 10 EU/tLV
Reinforced Epoxy Resin Plate1Oak 18 annealed copper foil · 125 mB sulfuric acidAnnealed copper foilSulfuric acid1
up to 32 EU/t25 s
Fiber Reinforced Circuit BoardFiber-Reinforced Circuit Board1
gtceu:lv_chemical_reactor
Chemical Reactor in the cleanroom · 60 s · 30 EU/t · 12 annealed copper foil + 1 B iron III chlorideLV
Fiber Reinforced Circuit BoardFiber-Reinforced Circuit Board1
up to 32 EU/t60 s
Fiber Reinforced Printed Circuit BoardExtreme Circuit Board1
gtceu:lv_chemical_reactor

Flow

How to build

  1. Drawers first, one per input: nano CPU wafers, indium gallium phosphide dust, carbon fibers, annealed copper foil. Drums: radon, epoxy, sulfuric acid, iron III chloride. Each machine gets its own input drawer/drum behind a Modular Router or Pipez pipe with an Item Filter, and a Robot Arm cover in Keep Exact mode on its output. — functionalstorage:oak_1, gtceu:nano_cpu_wafer, gtceu:indium_gallium_phosphide_dust, gtceu:annealed_copper_foil
  2. Qubit wafer: the EV Chemical Reactor inside the cleanroom takes 1 nano CPU wafer + 1 indium gallium phosphide dust and 50 mB radon from the radon drum (Pipez fluid pipe) → 1 qubit CPU wafer in 60 s at 1920 EU/t. Keep Exact 2 on the output. — gtceu:ev_chemical_reactor, gtceu:radon_bucket, gtceu:qbit_cpu_wafer
  3. Cutter in the cleanroom, ghost nothing needed: 1 wafer → 4 qubit CPU chips in 45 s at 1920 EU/t. Chips into a drawer Keep Exact 8 (2 per mainframe). — gtceu:ev_cutter, gtceu:qbit_cpu_chip
  4. Reinforced plate: LV Chemical Bath, 1 carbon fibers + 144 mB epoxy → 1 plate in 12 s at 16 EU/t. Epoxy comes from the epoxy chain (large chemical reactor), a drum on a Pipez fluid pipe. — gtceu:lv_chemical_bath, gtceu:reinforced_epoxy_resin_plate, gtceu:epoxy_bucket
  5. Fiber board (outside the cleanroom): plate + 8 annealed copper foil + 125 mB sulfuric acid → fiber board in 25 s at 10 EU/t. Its own reactor, its own foil drawer. — gtceu:lv_chemical_reactor, gtceu:fiber_reinforced_circuit_board, gtceu:annealed_copper_foil
  6. Extreme board (inside the cleanroom): fiber board + 12 annealed copper foil + 1 B iron III chloride → extreme circuit board in 60 s at 30 EU/t. A third reactor; the board drawer feeds three circuit stages, so Keep Exact 16 and three routers. — gtceu:lv_chemical_reactor, gtceu:iron_iii_chloride_bucket, gtceu:fiber_reinforced_printed_circuit_board
  7. Easy to miss: build the boards before the circuit assemblers wait for them: 6 extreme boards per mainframe at 60 s each is 6 minutes of one reactor; make a second reactor or batch 24 boards while the line is idle. — functionalstorage:oak_1, gtceu:fiber_reinforced_printed_circuit_board

Tips

  • Qubit CPU wafer (CircuitRecipes qbit_cpu_wafer_radon, not changed by the pack): 1 nano CPU wafer + 1 indium gallium phosphide dust + 50 mB radon, chemical reactor, CLEANROOM, 1200 ticks at VA[EV] = 1920 EU/t. The other recipe (qbit_cpu_wafer_quantum_eye: 1 nano CPU wafer + 2 quantum eyes + 288 mB gallium arsenide, 900 ticks) needs ender eyes, and the pack REMOVES every crafting recipe whose output is minecraft:ender_eye (mass_removals.js), so use the radon route. Cutter (cut_qbit_cpu): 1 wafer → 4 qubit CPU chips, 900 ticks at 1920 EU/t, cleanroom (EV Cutter). One ZPM mainframe needs 2 chips = half a wafer = 25 mB radon, so radon is a trickle, not a line.
  • Nano CPU wafer: the luv_chips chain (CPU wafer + 16 carbon fibers + 576 mB glowstone, EV chemical reactor in the cleanroom, 1200 ticks). Indium gallium phosphide dust is the same dust the HPIC and UHPIC wafers use (iv_hatches chain). So the quantum line costs one extra nano CPU wafer per 4 qubit chips and nothing from a new tier.
  • Radon sources (all verified in recipes, pick one): (1) the LuV Fusion Reactor, reflector tier 1: 144 mB gold + 100 mB mercury → 1000 mB radon, 28.8 s, 30 720 EU/t, start 200 MEU (kjs systems/fusion/fusion_scaling.js); (2) Large Chemical Reactor, 480 EU/t, 4000 ticks: 8 plutonium-239 ingots (returned) + 1 uranium-238 dust + 10 B air → 1 B radon (ReactorRecipes radon_from_uranium_238, not removed by the pack as far as the removal lists show); (3) distilling liquid ender air, IV Distillation Tower: 200 B → 1 B radon among nitrogen dioxide, deuterium, helium and others (DistillationRecipes); (4) the Exotic Gas Siphon (VA[ZPM]): 1000 mB radon per run in the End, 750 mB in Abydos, with circuit 4 / 2 (kjs systems/resource_gen/exotic_gas_siphon.js). Quantum stars (1250 mB radon each, HV Chemical Bath) are the big radon sink of the ZPM components.
  • Extreme board (CircuitRecipes, not changed by the pack): reinforced epoxy resin plate = 1 carbon fibers (or 1 fine borosilicate glass wire) + 144 mB epoxy in a Chemical Bath, 240 ticks at 16 EU/t. Fiber board = that plate + 8 annealed copper foil + 125 mB sulfuric acid, chemical reactor, 500 ticks at 10 EU/t (no cleanroom). Extreme circuit board = fiber board + 12 annealed copper foil + 1000 mB iron III chloride (or 2000 mB sodium persulfate), chemical reactor, CLEANROOM, 1200 ticks at 30 EU/t. The pack also adds a copper chloride etch (circuit_etching.js, 500 mB cupric chloride solution) but its only source is the Chemical Plant skip, so keep iron III chloride. Ids: gtceu:fiber_reinforced_circuit_board (unetched) and gtceu:fiber_reinforced_printed_circuit_board (extreme board).
  • Counts per ZPM mainframe on the quantum route: 6 extreme boards (2 + 2 + 2 over the three stages), 2 qubit chips, 2 nano CPU chips, 120 annealed copper foil in boards (6 x 20), 6 x 144 mB epoxy, 6 x 125 mB sulfuric acid, 6 B iron III chloride. Annealed copper foil: annealed copper ingot (EBF/freezer product of the copper line) into a bender, 1 plate → 4 foil.
  • Sub-steps people skip: (1) the fiber board step is NOT in the cleanroom but the extreme board step is; (2) borosilicate glass wire is an extruder recipe (96 EU/t, 160 ticks, 8 wire per borosilicate glass ingot) if you have no carbon fibers; (3) do not mix the fiber board with the multilayer board of the crystal line (zpm_crystal): different drawer; (4) 25 mB of radon needs only a tiny drum, set Keep Exact so a stuck reactor cannot swallow a whole bucket.
  • Unverified which machine tier accepts the 50 mB radon input in an ordinary fluid hatch (a single EV hatch should), the supply of plutonium-239 for the Large Chemical Reactor route, and the mercury source for the fusion route.

Bill of materials

Item Qty
gtceu:ev_chemical_reactor 1
gtceu:ev_cutter 1
gtceu:lv_chemical_bath 1
gtceu:lv_chemical_reactor 2
gtceu:cleanroom 1
functionalstorage:oak_1 12
modularrouters:modular_router 8
gtceu:lv_robot_arm 8
gtceu:item_filter 8
pipez:item_pipe 16
pipez:fluid_pipe 5
gtceu:steel_drum 4

Needs / Feeds