Skip to content

LuV chips: Nano CPU chip (CPU wafer + carbon fibers + molten glowstone) and NOR memory chip (phosphorus wafer)

Chain id: luv_chips · Tags: Infinite source

Era setup: LuV

Plan modules: Advanced boards and nano chips

Tips: 6

Machines

MV Laser Engraver · light blue lens · 45 s · 120 EU/tMV
Silicon Wafer1
up to 128 EU/t45 s
CPU Wafer1
gtceu:mv_laser_engraver
EV Chemical Reactor in the cleanroom · 60 s · 1920 EU/tEV
CPU Wafer1Oak 116 Raw carbon fibers · 576 mB molten glowstoneRaw carbon fibersMolten glowstone
up to 2 048 EU/t60 s
Nano CPU Wafer1
gtceu:ev_chemical_reactor
HV Cutter in the cleanroom · 45 s · 480 EU/tHV
Nano CPU Wafer1
up to 512 EU/t45 s
Nano CPU Chip8 Nano CPU chips8
gtceu:hv_cutter
HV Laser Engraver in the cleanroom · pink lens · 45 s · 480 EU/tHV
Phosphorus Wafer1
up to 512 EU/t45 s
NOR Memory Wafer1
gtceu:hv_laser_engraver
HV Cutter in the cleanroom · 45 s · 192 EU/tHV
NOR Memory Wafer1
up to 512 EU/t45 s
NOR Memory Chip16 NOR memory chips16
gtceu:hv_cutter

Flow

How to build

  1. Drawers first: silicon wafers, phosphorus wafers, CPU wafers, raw carbon fibers, and one drum of molten glowstone and one of polyethylene. One dedicated machine per product: the CPU engraver, the nano reactor, the nano cutter, the NOR engraver and the NOR cutter never share a bus. Pipez item pipes with Item Filters and Robot Arm covers in Keep Exact mode, as in the other chains. — functionalstorage:oak_1, gtceu:silicon_wafer, gtceu:phosphorus_wafer, gtceu:carbon_fibers
  2. CPU wafer: MV Laser Engraver with the light blue lens in its bus slot (the lens is not consumed), silicon wafer in, 45 s at 120 EU/t. This is the same machine as the HV circuit chain, so reuse that wafer drawer if it already exists. — gtceu:mv_laser_engraver, gtceu:light_blue_glass_lens, gtceu:cpu_wafer
  3. Carbon fibers: LV Autoclave, 4 carbon dust + 36 mB polyethylene, 37 ticks. 16 fibers per nano wafer, so keep a drawer of 64 carbon dust feeding it. Carbon dust: coal dust → centrifuge (see the IV motor tip). — gtceu:lv_autoclave, gtceu:carbon_dust, gtceu:carbon_fibers
  4. Nano wafer: EV Chemical Reactor inside the Cleanroom. 1 CPU wafer + 16 fibers + 576 mB molten glowstone, 60 s at 1920 EU/t (an EV cable, no hatch). Pipe the glowstone from its drum through the wall by a passthrough hatch. — gtceu:ev_chemical_reactor, gtceu:cleanroom, gtceu:nano_cpu_wafer
  5. HV Cutter inside the room: nano wafer → 8 Nano CPU chips, 45 s at 480 EU/t. Output into a drawer with Keep Exact 16; the mainframe line takes 2 per mainframe. — gtceu:hv_cutter, gtceu:nano_cpu_chip
  6. NOR wafer: HV Laser Engraver inside the room with the pink lens, 1 phosphorus wafer → 1 NOR memory wafer, 45 s at 480 EU/t. The phosphorus wafer drawer is filled by the cutter of the iv_hatches chain. — gtceu:hv_laser_engraver, gtceu:pink_glass_lens, gtceu:nor_memory_wafer
  7. Second HV Cutter: 1 NOR wafer → 16 NOR memory chips, 45 s at 192 EU/t. Output drawer with Keep Exact 16 (the supercomputer stage takes 4 per craft, 8 per mainframe). — gtceu:hv_cutter, gtceu:nor_memory_chip

Tips

  • Recipes (CircuitRecipes, the pack does not change them): CPU wafer = silicon wafer + light blue lens in a laser engraver, 900 ticks at 120 EU/t, no cleanroom (the same wafer as the HV circuit line). Nano CPU wafer = 1 CPU wafer + 16 raw carbon fibers + 576 mB molten glowstone, chemical reactor, CLEANROOM, 1200 ticks at 1920 EU/t (EV). Nano CPU chips: 1 wafer → 8 chips, cutter, CLEANROOM, 900 ticks at 480 EU/t.
  • NOR memory chip: NO silicon recipe exists. It needs a phosphorus-doped wafer: HV Laser Engraver, pink lens, CLEANROOM, 900 ticks at 480 EU/t → 1 NOR memory wafer; cutter, CLEANROOM, 900 ticks at 192 EU/t → 16 chips. The phosphorus boule → 32 wafers line is the one in the iv_hatches chain (EBF 2484 K, 10 minutes), so build that first. Naquadah wafers give 4 NOR wafers per wafer but need a naquadah boule (ZPM quest tier).
  • Raw carbon fibers: autoclave, 4 carbon dust + 36 mB polyethylene → 1 fiber, 37 ticks at 30 EU/t (an LV Autoclave runs it); the PTFE version (4 carbon + 18 mB PTFE → 2) needs MV. So one nano CPU wafer = 64 carbon dust + 576 mB polyethylene. Molten glowstone: glowstone dust (the dust sieve) melted in an extractor/fluid heater, 4 dust per 576 mB (144 mB each). Unverified: which machine the pack leaves for melting glowstone dust (check EMI).
  • How much you need: one Nanoprocessor Mainframe eats 2 nano CPU chips (a quarter of one wafer) and 8 NOR chips (half of one NOR wafer). One CPU wafer → one nano wafer → 8 chips is therefore 4 mainframes; one phosphorus wafer → 16 NOR chips is 2 mainframes. The chips are not the bottleneck, the phosphorus boule (10 min) and the RAM are.
  • Cleanroom: three machines here sit inside the room (EV chemical reactor, both HV cutters) plus the HV laser engraver for NOR: four machines. The wafer engraving for the plain CPU wafer (MV laser engraver) can stay outside. A cleanroom machine runs only while the room is 95 % clean.
  • Sub-steps people skip: (1) the lens is pink for NOR, light blue for CPU; (2) the cutter needs a coolant fluid (water or lubricant) in this GT version: Unverified, copy the amount the HV circuit chain uses; (3) the NOR cutter is 192 EU/t, not 480; (4) never let a wafer drawer feed two machines, the CPU wafer goes ONLY to the chemical reactor; (5) the carbon fibers are the slow input, build the autoclave first.

Bill of materials

Item Qty
gtceu:mv_laser_engraver 1
gtceu:hv_laser_engraver 1
gtceu:ev_chemical_reactor 1
gtceu:hv_cutter 2
gtceu:lv_autoclave 1
gtceu:cleanroom 1
functionalstorage:oak_1 12
modularrouters:modular_router 8
gtceu:lv_robot_arm 8
gtceu:item_filter 8
pipez:item_pipe 16
pipez:fluid_pipe 6
gtceu:steel_drum 3

Needs / Feeds