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HV circuits: Advanced Integrated Circuit and Microprocessor Assembly

Chain id: circuits_hv

Era setup: HV

Plan modules: SMDs and HV circuits

Tips: 4

Machines

3 MV Laser Engravers (red / green / light blue lens)MV
Silicon WaferSilicon wafers
up to 128 EU/t
Ilc ChipILC chips8 per waferRAM ChipRAM chips32 per waferCPU ChipCPU chips8 per wafer
gtceu:mv_laser_engraver
LV Circuit Assembler · basic integratedLV
Ilc ChipILC chips1
up to 32 EU/t
LV Circuit AssemblerLV Circuit Assembler · good integrated2
gtceu:lv_circuit_assembler
LV Circuit Assembler · good integratedLV
LV Circuit AssemblerLV Circuit Assembler · basic integrated2
up to 32 EU/t
LV Circuit AssemblerLV Circuit Assembler · advanced2
gtceu:lv_circuit_assembler
LV Circuit Assembler · advancedLV
LV Circuit AssemblerLV Circuit Assembler · good integrated2Ilc ChipILC chips2RAM ChipRAM chips2TransistorTransistors4
up to 32 EU/t40 s
Advanced Integrated Circuit
gtceu:lv_circuit_assembler
MV Circuit Assembler · processorMV
CPU ChipCPU chipsPlastic Printed Circuit BoardPlastic printed board
up to 128 EU/t
MV Circuit AssemblerMV Circuit Assembler · assembly2
gtceu:mv_circuit_assembler
MV Circuit Assembler · assemblyMV
MV Circuit AssemblerMV Circuit Assembler · processor2Plastic Printed Circuit BoardPlastic printed boardRAM ChipRAM chips4
up to 128 EU/t20 s
Micro Processor AssemblyMicroprocessor Assembly
gtceu:mv_circuit_assembler

Flow

How to build

  1. Wafers: EBF (cupronickel, MV hatch) 32 silicon dust + 1 small gallium arsenide dust, circuit 2, 1784 K, 120 EU/t, 7.5 min → 1 boule. MV Cutter: 1 boule → 16 wafers in 20 s at 64 EU/t with 20 mB lubricant (water: 80 mB and 40 s, distilled: 60 mB and 30 s). One boule per 7.5 min is the real cap: 2.1 wafers a minute. — gtceu:silicon_boule, gtceu:mv_cutter, gtceu:silicon_wafer
  2. Three MV Laser Engravers, one lens each, never swapped: red lens → ILC wafer, green lens → RAM wafer, light blue lens → CPU wafer. Each takes 1 silicon wafer, 45 s, 120 EU/t. A Robot Arm cover (Keep Exact 8) per engraver pushes the wafer into a drawer for the cutter. — gtceu:mv_laser_engraver, gtceu:red_glass_lens, gtceu:ilc_wafer
  3. Cutting, same MV Cutter with lubricant: ILC wafer → 8 ILC chips (45 s, 64 EU/t, 45 mB), RAM wafer → 32 RAM chips (45 s, 96 EU/t, 67 mB), CPU wafer → 8 CPU chips (45 s, 120 EU/t, 84 mB). Chips go to three drawers; one advanced circuit uses 3 ILC and 2 RAM, so even one wafer lasts long. — gtceu:mv_cutter, gtceu:ilc_chip, gtceu:ram_chip, gtceu:cpu_chip
  4. Transistors, one MV Assembler: 1 silicon plate + 6 fine tin wire + 144 mB polyethylene → 8 transistors in 8 s at 120 EU/t (60 a minute). Polyethylene is the MV plastic line; keep a drum of it beside the assembler. — gtceu:mv_assembler, gtceu:transistor
  5. Circuit Assembler 1 (basic integrated): LV circuit board (the resin one) + 1 ILC + 2 resistors + 2 diodes + 2 fine copper wire + 2 tin bolts → 2 circuits in 10 s at 16 EU/t, plus solder. — gtceu:lv_circuit_assembler, gtceu:basic_integrated_circuit
  6. Circuit Assembler 2 (good integrated): phenolic printed board (the MV silver-foil board) + 2 basic integrated + 2 resistors + 2 diodes + 4 fine gold wire + 4 silver bolts → 2 circuits in 20 s at 24 EU/t. — gtceu:lv_circuit_assembler, gtceu:good_integrated_circuit, gtceu:phenolic_printed_circuit_board
  7. Circuit Assembler 3 (advanced integrated): 2 good integrated + 2 ILC + 2 RAM + 4 transistors + 8 fine electrum wire (1 electrum ingot in a wiremill, circuit 3) + 8 annealed copper bolts → 1 circuit in 40 s at 30 EU/t. One machine gives 1.5 a minute. Each machine gets its own input drawers and an output drawer, with Robot Arm Keep Exact 64 on its output. — gtceu:lv_circuit_assembler, gtceu:advanced_integrated_circuit, gtceu:electrum_ingot
  8. Second route, once an MV Circuit Assembler stands: plastic printed board + 1 CPU + 4 resistors + 4 capacitors + 4 transistors + 4 fine red alloy wire → 2 microprocessors in 10 s at 60 EU/t. Plastic board: 1 polyethylene plate + 4 copper foil + 250 mB sulfuric acid → 1 board (25 s, 10 EU/t, chemical reactor), then 1 board + 6 copper foil + 250 mB iron III chloride (30 s, 30 EU/t) → printed board. — gtceu:mv_circuit_assembler, gtceu:micro_processor, gtceu:plastic_printed_circuit_board
  9. Microprocessor Assembly, a second MV Circuit Assembler: plastic printed board + 2 microprocessors + 4 inductors + 8 capacitors + 4 RAM + 8 fine red alloy wire, 288 mB tin → 2 assemblies in 20 s at 120 EU/t. Inductor: 1 steel ring + 2 fine copper wire + 36 mB polyethylene → 2 (MV assembler 16 s, 120 EU/t); capacitor: 1 polyethylene foil + 2 aluminium foil + 144 mB polyethylene → 8 (16 s). — gtceu:mv_circuit_assembler, gtceu:micro_processor_assembly, gtceu:inductor
  10. Easy to miss: the hand-crafted good circuit board is removed in this pack, so boards only come from the chemical reactor etch. Every circuit recipe also wants solder fluid: keep a 144 mB tin drum on each assembler or it stalls with all items present. Do not build the cleanroom for this step. — functionalstorage:oak_1, gtceu:advanced_integrated_circuit

Tips

  • First HV circuit = Advanced Integrated Circuit. Its recipe has no cleanroom tag and runs on an LV Circuit Assembler: 2 good integrated + 2 ILC + 2 RAM + 4 transistors + 8 fine electrum wire + 8 annealed copper bolts + 144 mB tin, 40 s at 30 EU/t. You need it to build the MV Circuit Assembler (2 HV circuits).
  • Microprocessor Assembly is the second HV circuit and needs the MV Circuit Assembler: 1 plastic printed board + 2 microprocessors + 4 inductors + 8 capacitors + 4 RAM + 8 fine red alloy wire (+288 mB tin), 20 s at 120 EU/t, gives 2.
  • All three chips come from silicon wafers: no cleanroom until phosphorus wafers (HV, 480 EU/t) and SoCs (600 EU/t and up). Every circuit assembler recipe also takes solder: 144 mB tin, or 72 mB soldering alloy.
  • Stock 32 of one type first: HV Assembler, Chemical Reactor and Mixer each take 2 HV circuits, the LCR 4, the MV Circuit Assembler 2, the cleanroom 1.

Bill of materials

Item Qty
gtceu:lv_circuit_assembler 3
gtceu:mv_laser_engraver 3
gtceu:mv_cutter 1
gtceu:mv_assembler 1
gtceu:mv_circuit_assembler 2
functionalstorage:oak_1 14
modularrouters:modular_router 4
gtceu:lv_robot_arm 6
gtceu:item_filter 6
pipez:item_pipe 16
pipez:fluid_pipe 6

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